Chennai, Tamil Nadu, India
Process, Bond Market, Social Movement
About
I am panneerselvam, working as process engineer in wirebond with 3+ years of experiance
Talents
Work Experience
Process engineer
SPEL Semiconductors LTD
Full Time Aug-2010 To present 14 years 8 months
Responsibilities
  • ? Played active role in Installing robust Copper line to support to QFN and SOIC package using Bare Copper wire and Palladium coated copper wire
    ? Optimized the bond parameters using DoE to handle 0.8 um bond pad thickness using both Copper wire and Palladium coated Copper wire
    ? Good exposure in calibration and maintenance techniques.
    ? New Products qualification.(Program development & Assembly),
    ? New supplier qualification (Raw materials & Consumables),
    ? Yield monitoring through process control tools (online SPC),
    ? Micro Analysis on critical defects at Wire bond,
    ? Design of P-Parts for all wire bond m/c’s (Heater plate & Down holder) modification and Qualification,
    ? New m/c qualification and installation
    ? M/c set-up and troubleshooting process related issues,
    ? M/c Programs recipe management,
    ? PM activities to improve OEE,
    ? To increase m/c availability by monitoring m/c history data,
    ? Training to technician level personnel.
Achievements
  • ? Defined and standardized the process parameters for new packages
    ? Reduced WIREBOND DPM by optimizing the parameters and analysis of material qualification and validation
    ? Analysis of new Bonding tool with various parameters and various materials
    ? Setting the various looping parameters for the complicated packages to establish a robust window
» 1 Project
Education
Bachelor of Education, Mechanical Engineering
2007-2010
Extra-Curricular Interests
  • chess

  • Table Tennis

Profile Snapshot
Panneerselvam is based out of Chennai & has studied ME-Mechanical Engineering, B.Ed-Bachelor of Education from Year 2007-2010 in TPGIT-Thanthai Periyar Government Institute of Technology, Anna University.
Panneerselvam Annamalai is Skilled in Process Engineering, Bond Market, Social Movement and other talents.